Molded Interconnect Devices and Sensors
Electronic functions are nowa-days not conceivable without plastics. Because of their mould-ability and e.g. their electrical isolating properties plastics opened the door for the develop-ment of complete new products e.g. in the fields of communica-tion or media technology.
Furthermore the specific coating or modification of plastics allows the advanced integration of elec-trical functions in plastic parts.
Examples are:
• Three dimensional Moulded Interconnect Devices (3-D MID)
• Polymer Bonded Magnets
• the integration of antistatic or shielding effects using modified
plastics and process technology
Beyond this already today there are plastics whose electrical conduc-tivity reaches that of steel and whose heat conductivity is 100 times higher than that of unmodified plastics.
In cause of this complete new electrical and heat conductive applications are possible.
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